Latest AI and tech news
▲ SKHU President Hyeongsoo Kim delivering the closing remarks...
▲ Industry experts taking part in the panel discussion, together with SK hynix Vice President Hyungsoo Kim, head of the DRAM Design department (first from left)...
▲ SK hynix Vice President Kyunghoon Kim, head of the Design Research Lab, delivering the third keynote presentation...
▲ SK hynix Vice President Euicheol Lim, head of the Solution AT department, delivering the second keynote presentation...
▲ SK hynix Vice President Jaewuk Ju, head of the Smart Manufacturing Technology/AX Advance department, delivering the first keynote presentation...
▲ SK hynix CEO Kwak Noh-Jung delivering the welcoming remarks at the 2026 Future Forum...
▲ SK hynix CEO Kwak Noh-Jung delivering the welcoming remarks at the 2026 Future Forum...
As AI workloads evolve toward inference and agentic AI, the criteria for system performance are also changing. Computing power alone is no longer enough. Where data is stored, how quickly it moves, and how efficiently it is processed now have a direc...
AI is no longer defined by a single model or chip. For AI to operate effectively in real-world services and industrial applications, it takes faster compute, greater memory bandwidth, higher-performance networking, more efficient storage, and stable ...
SK hynix held a groundbreaking ceremony for its Indiana fab on Aug. 27 (local time) at Purdue University’s Holloway Gymnasium, located in West Lafayette, Indiana, taking its first step toward securing a local AI memory production base in the United S...
▲ Rendering of the AI memory advanced packaging production base being constructed by SK hynix in West Lafayette, Indiana, U.S...
Seoul, August 28, 2026 – SK hynix Inc. (or “the company”, www.skhynix.com) is opening a new future for AI cooperation between the United States and South Korea by establishing a first next-generation High Bandwidth Memory(HBM) production hub in the U...
▲ Youngpyo Joo, Vice President andhead of the System Architecture department, delivers the keynote...
▲ The ‘Product & System’ exhibition space, where visitors could explore SK hynix’s diverse AI memory products...
▲ The ‘Product & System’ exhibition space, where visitors could explore SK hynix’s diverse AI memory products...
▲ Conceptual illustration of an optics-centric architecture in which a photonic interposer directly connects compute resources in the XPU pool with memory resources in the memory pool through optical links...
▲ CPO integrates optical engines ever closer to the processor. As the distance traveled by electrical signals is minimized, both bandwidth and energy efficiency improve....
▲ Compute throughput has typically tripled every two years, while interconnect bandwidth has advanced only about 1.4-fold, creating a “bandwidth wall.”...
[Read the paper]
∙ Title: Co-packaged optics for high-performance computing and artificial intelligence
∙ Published in: Nature Electronics, 2026
∙ Authors: Seunghoon Hong (AI Infra Team Lead, SK hynix); Professor Kyusang Lee, Department of Electrical...